Location
singapore, singapore, Singapore
Posted
June 11, 2026
Job Description
AMD is offering an internship in Singapore focused on mechanical and thermal analysis of advanced packaged devices. Interns will gain hands-on experience with analysis techniques, data tools, and collaborate with cross-functional teams. Ideal for students pursuing a Master's or PhD in related engineering fields, the role emphasizes independent work, strong analytical, communication, and presentation skills. Internship lasts from May to December 2026 with potential extension.
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