Lead Platform Packaging Engineer

Infineon Technologies AG

Full-time Engineering
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Location
malacca city, malacca, Malaysia
Posted
June 11, 2026

Job Description

Infineon Technologies AG in Malacca City is seeking a Package Design Engineer to lead technical definition activities for packaging projects. Candidates should have a Bachelor’s Degree in Engineering and at least 9 years of relevant experience in the IC/semiconductor field.

The role entails generating internal drawings, defining package requirements, and coordinating cost estimates. Infineon values diversity and offers an inclusive work environment.

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