Location
seberang perai, penang, Malaysia
Posted
June 05, 2026
Job Description
Project Title
Selective Solder Tooling Enhancement and BOL Conversion Readiness Enhancement
Description
Enhance selective solder process robustness by introducing tooling improvements while strengthening BOL conversion readiness by introducing a standardized tooling selection system covering Cornerfill (CF), Selective Solder (SS) and Enclosure Assembly (EA). The project aims to reduce conversion ambiguity, setup errors and process variability across BOL operations.
Scope
- Selective Solder Tooling Enhancement (SS)
- Qualify and release selective solder process enhancement toolings to improve setup stability, consistency and repeatability
- Address tooling‑related contributors to process variation during selective solder operations
- BOL Conversion Readiness Enhancement (CF, SS, EA)
- Develop and implement a tooling selection system defining required toolings for each product conversion across BOL