Location
bayan lepas, penang, Malaysia
Posted
July 11, 2026
Job Description
Responsibilities
- Learn process fundamental for Die attach and Wire bond process
- Apply data analysis techniques such as Statistical Process Control to identify the product issue and propose new improvement project
- Collaborate closely with engineers, gaining an understanding of the entire workflow from Front of Line to End of Line.
Qualifications
- Education Background: Bachelorβs degree in Material, Mechanical, Manufacturing Engineering, or a related discipline
- Programming Knowledge: Exposure to programming languages such as C, C++, or Python (through coursework or projects)
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status...