Intern- Process Engineering Assistant

Full-time Other-General

Project Title

Backgrind Process Wafer Thickness run to run auto thickness adjustment enablement

Project Description

Data analytics and machine auto-adjustment has been introduced in Micron manufacturing operations to improve efficiency. Auto drift detection analysis and correction will significantly improve the process efficiency.

Objective

Enable wafer thickness drift detection and auto correction.

Scope

• Explore various machine learning techniques for feature selection, simulation, evaluation, and measurement data.
• Explore inline and probe data correlation.
• Explore multiple variables optimization.
• Explore SPC.

Deliverables

Stable process with early drift detection and auto-correction.

Impact

Improve product quality control and process efficiency.

Required Skill Set

• General problem solving, data analytics, and SPC.

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