Location
, penang, malaysia, penang, Malaysia
Posted
July 04, 2026
Job Description
Project Title
Improvement of NSOP (Non‑Stick On Pad) Alarm for WB Process Early Detection
Scope
- Define and standardize NSOP (Non‑Stick On Pad) failure criteria in the WB process
- Improve NSOP alarm logic for early detection before mass failure occurs
- Collaborate with EE and Manufacturing Engineers to align alarm thresholds with actual bonding behavior
- Execute UAT and pilot run on selected WB machines after alarm enhancement
- Collect NSOP event data for downtime, frequency, and failure trend analysis
Deliverables
- Clearly defined NSOP detection criteria for WB process
- Improved or new NSOP alarm with early warning capability
- Reduction in unscheduled downtime caused by delayed NSOP detection
- NSOP alarm data available for equipment and process improvement analysis
Stretch Goal
- Correlate NSOP alarms with bond parameters (US power, force, tim...