Innovation Engineer, Assembly Media & Collaterals

Intel Corporation

Full-time Engineering
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Location
kulim, kedah, Malaysia
Posted
July 20, 2026

Job Description

Intel Foundry in Kulim, Malaysia, seeks an engineering professional to develop media and collaterals for assembly processes and to apply novel concepts enabling the roadmap of future packaging technologies.

You will optimize manufacturing efficiency and develop specifications using DOE and SPC, work with AutoCAD/SolidWorks, and lead design improvements while collaborating with cross-functional teams to meet product milestones.

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