Location
chennai, tamil nadu, India
Posted
July 18, 2026
Job Description
Job Title: IC Packaging Engineer
Job Overview
We are seeking a highly skilled and motivated IC Packaging Engineer to join our Advanced Packaging and Hardware Development team. In this role, you will be responsible for the design, development, simu lation, and qualification of next-generation semiconductor packaging technologies. You will bridge the gap between silicon design and physical manufacturing, ensuring our integrated circuits (ICs) meet rigorous performance, reliability, and cost standards.
Key Responsibilities
1. Package Design & Development
Lead the conceptualization, architecture, and detailed design of semiconductor packages (e.g., BGA, QFN/QFP, WLCSP, SiP, 2.5D/3D IC, and Chiplets).
Generate package substrate layouts, ball maps,bond diagram and ball assignments while optimizing for signal i...