Head of Consumer Electronics Packaging Engineering (Requires Relocation)
Shanghai BSF Human Resources Co., Ltd
Full-time
Business Engineering & Management
Location
singapore, singapore, Singapore
Posted
June 18, 2026
Job Description
Head of Consumer Electronics Packaging Engineering (Requires Relocation)
We are seeking a highly qualified Package Process Engineering leader to join our dynamic team within the consumer electronics industry. The ideal candidate will possess a robust background in package development and engineering, coupled with specialized knowledge of Apples packaging products and processes.
Responsibilities
- Research and Analysis : Conduct research on technology trends in the industry and competitors to formulate strategic development plans.
- Technical Management : Develop and modify the company's technical management system and process standards, including safety regulations.
- New Technology Implementation : Oversee the introduction of new technologies and product development to expand product variety.
- Project Participation : Engage in equipment selection, trial production, and process design for new pro...