Location
Phoenix, AZ, United States
Posted
June 03, 2026
Job Description
**Job Details:**
**Job Description:**
The Role and Impact
As a Product Packaging Engineer, you will play a key role in developing Intel’s next-generation packaging solutions for semiconductor and electronic products. In this role, you will contribute to the design, development, qualification, and optimization of packaging technologies that support product performance, manufacturability, scalability, and sustainability.
Working closely with cross-functional teams across engineering, manufacturing, supply chain, and quality organizations, you will help drive innovative packaging solutions that enable Intel to remain a leader in advanced semiconductor technology. This position offers the opportunity to combine technical expertise, problem-solving, and innovation to deliver impactful solutions on a global scale.
Key Responsibilities
+ Design, develop, and qualify packaging materials and solutions for semiconductor and electronic product...
**Job Description:**
The Role and Impact
As a Product Packaging Engineer, you will play a key role in developing Intel’s next-generation packaging solutions for semiconductor and electronic products. In this role, you will contribute to the design, development, qualification, and optimization of packaging technologies that support product performance, manufacturability, scalability, and sustainability.
Working closely with cross-functional teams across engineering, manufacturing, supply chain, and quality organizations, you will help drive innovative packaging solutions that enable Intel to remain a leader in advanced semiconductor technology. This position offers the opportunity to combine technical expertise, problem-solving, and innovation to deliver impactful solutions on a global scale.
Key Responsibilities
+ Design, develop, and qualify packaging materials and solutions for semiconductor and electronic product...