Location
, , malaysia, , , malaysia, Malaysia
Posted
July 02, 2026
Job Description
The Failure Analysis Section Manager leads the failure analysis function for semiconductor backend and advanced packaging operations, ensuring rapid root cause identification and resolution of complex technical issues. This role combines technical expertise, team leadership, and customer-facing responsibilities to drive yield improvement, reliability, and continuous operational excellence.
Description
- Lead, mentor, and develop the Failure Analysis (FA) team, driving capability building, performance management, and a culture of technical excellence
- Oversee end-to-end FA operations across customer returns (RMA), electrical test failures, assembly defects, and reliability issues, ensuring high‑quality output and fast turnaround time
- Lead complex failure investigations in advanced packaging technologies (e.g. Flip Chip, WLCSP, Fan‑Out, SiP, BGA), identifying key failure mechanisms and risks
- Guide the team on advanced FA methodologies an...