Job Description
Job Summary:ย
ยท New Package Technology and New Platform Module Developmentย
o Responsible for new package/technology development following Advanced Product Qualification Plan (APQP).ย
o Good understanding of MRS and generate PRS with SCD definition.ย
o Responsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal.ย
o Familiar with DFM, to secure robust manufacturability with quality requirements.ย
o Good understanding of power module package design rule, design rule update with new platform development.ย
o Generate deliverables upon package development procedure (DFMEA, control plan, process FMEA, LAR plan, QFD, .ย
o Planning and execution for development activities per development phase with process development engineers (feasibility, process characterization, LAR, .ย
o Drive problem solving methodology wi...