Director of Packaging Engineering – Consumer Electronics
Shanghai BSF Human Resources Co., Ltd
Full-time
Business Engineering & Management
Location
singapore, singapore, Singapore
Posted
June 26, 2026
Job Description
A recruiting firm is seeking a highly qualified Head of Consumer Electronics Packaging Engineering to lead development efforts. The ideal candidate will have over 10 years of experience in package development and a strong background in Apple's packaging solutions. Key responsibilities include strategic planning, technical management, and project leadership. This position requires openness to relocate to China for a long-term commitment, making strong communication skills critical for success.
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