Location
Haidian District, Beijing, China
Posted
July 22, 2026
Job Description
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Digital Design Lead Beijing
Description
The successful candidate will be responsible to lead digital SoC development for cutting edge physical intelligence ICs such as high-performance MCU/DSP/NPU products used in Automotive smart cockpit and Industrial applications.
In this role, you will take ownership of both technical leadership and team/project execution. You will lead a team of digital designers to deliver complex digital SoCs that enable next-generation audio processors and other physical intelligence areas. This role requires strong hands-on expertise, system-level thinking, and proven capability to drive projects across multiple milestones through tape-out.
Key Responsibilities:
Technical Leadership