Location
seremban, negeri sembilan, Malaysia
Posted
July 13, 2026
Job Description
Nexperia in Malaysia is looking for an engineer responsible for the Die Bond and Wire Bond processes in a semiconductor assembly line. You will own process and equipment performance, and ensure high equipment uptime and quality in a high-volume manufacturing environment.
The ideal candidate has a Bachelor's degree in engineering and 2–3 years of relevant experience. Key responsibilities include managing tooling, conducting analyses, and collaborating across teams to ensure process reliability.
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