CUF TD Module Engineer

Full-time Engineering

Job Details

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

Responsibilities

• Develops assembly processes and/or equipment for CUF (capillary underfill) module and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
• Ensures manufacturability of physical layout of package design and ...