Location
kulim, kedah, Malaysia
Posted
July 18, 2026
Job Description
Intel Corporation in Malaysia seeks an experienced engineering professional to develop and optimize assembly processes and equipment for CUF packaging modules. The role emphasizes applying novel concepts to enable the roadmap of future packaging technologies, with a focus on quality, yield, cost and manufacturability.
The candidate will design experiments, analyze data, and document improvements while ensuring supplier and contract assembler coordination.
#J-18808-Ljbffr