CUF Module Engineer: Advanced Packaging Processes
PVH (Tommy Hilfiger/Calvin Klein)
Full-time
Engineering
Location
kulim, kedah, Malaysia
Posted
July 22, 2026
Job Description
Intel Foundry seeks an experienced process engineer to develop assembly processes and equipment for the CUF (capillary underfill) module, supporting future packaging platform technologies. The role focuses on DOE-driven process development, data analysis, and rigorous quality standards, with on-site responsibilities in Kulim, Malaysia.
You will optimize production efficiency, establish material specs with suppliers, and drive reliability while collaborating with packaging technology teams to
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