Location
singapore, singapore, Singapore
Posted
June 29, 2026
Job Description
Micron Technology in Singapore is seeking a Bonding Process & Equipment Engineer to be responsible for the development and optimization of wafer-level bonding processes. The ideal candidate will have strong knowledge of semiconductor bonding and advanced packaging technologies.
This role involves collaboration across teams to drive yield improvement and cost reduction, demanding excellent problem-solving skills and experience in manufacturing environments.
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