Location
kulim, kedah, Malaysia
Posted
July 18, 2026
Job Description
Job Overview
Develops media and collaterals for assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Responsibilities
- Optimizes and improves the efficiency of manufacturing of media and collaterals, developing improvements to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
- Develops media and collateral specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
- Develops and maintains equipment to evaluate media and collateral solutions under simulated field use conditions, such as heat, humidity, vibration, temperature cycle, and dynamic forces.
- Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with media and collateral qu...