Location
United States, United States, United States
Posted
June 20, 2026
Job Description
Our Client, an Aerospace and Defense company, is looking for multiple Assemblers for their Orlando, FL location. Responsibilities:
+ Perform advanced rework on circuit card assemblies, including but not limited to:
+ BGA (Ball Grid Array) reballing and replacement
+ QFN (Quad Flat No-Lead) and other leadless package rework
+ High-density connector rework and repair
+ Complex SMT (Surface Mount Technology) component replacement
+ Through-hole and surface mount technology (SMT) components
+ Fine pitch and high-density components
+ Utilize various soldering techniques, including hand soldering and reflow soldering
+ Uses microscope to verify correct part placement and orientation
+ Inspect and troubleshoot assemblies to identify defects and areas for improvement
+ Develop and implement rework procedures for new and existing products
+ Collaborate with engineering te...
+ Perform advanced rework on circuit card assemblies, including but not limited to:
+ BGA (Ball Grid Array) reballing and replacement
+ QFN (Quad Flat No-Lead) and other leadless package rework
+ High-density connector rework and repair
+ Complex SMT (Surface Mount Technology) component replacement
+ Through-hole and surface mount technology (SMT) components
+ Fine pitch and high-density components
+ Utilize various soldering techniques, including hand soldering and reflow soldering
+ Uses microscope to verify correct part placement and orientation
+ Inspect and troubleshoot assemblies to identify defects and areas for improvement
+ Develop and implement rework procedures for new and existing products
+ Collaborate with engineering te...