Location
Remote, Remote, Canada
Posted
July 20, 2026
Job Description
Job Description:
Broadcom is seeking an experienced IC Package Design Manager to lead a team of engineers designing complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 448G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. In this role, you will support and develop the engineering team, as well as contribute to technical methodologies and project management.
RESPONSIBILITIES:
- Understand the skill sets and traits of each team member, in order to maximize productivity and retention
- Project Management: Create and track project plans for 20+ concurrent designs (scope, schedules, resources)
- Organize team & customer activities to k...