Application Engineer - Bonder & Imaging Solutions (Travel)
SUSS
Full-time
Software Architecture & Engineering
Location
singapore, singapore, Singapore
Posted
June 18, 2026
Job Description
SUSS in Singapore is seeking an Application Engineer for Bonder. The role involves providing application support on SUSS MicroTec tools, project execution, and recipe optimization. The ideal candidate should have a degree in Engineering/Science and a minimum of 5 years of experience in Lithography wafer process engineering. Candidates must possess excellent problem-solving abilities, communication skills, and a self-driven attitude. Benefits include year-end bonuses and support for exams and events.
#J-18808-Ljbffr
#J-18808-Ljbffr