Location
Phoenix, AZ, United States
Posted
July 20, 2026
Job Description
**Job Details:**
**Job Description:**
The Stress Testing and Reliability Laboratory is seeking a motivated, hands-on engineer to join our Environmental Stress Tool Engineering team. In this role, you will play a key part in advancing Intel's next-generation packaging technologies, including EMIB, Foveros, Hybrid Bonding, and Co-Packaged Optics, while supporting package qualification and technology development efforts.
Our team develops, operates, and maintains a diverse fleet of environmental stress systems used to evaluate the reliability of Intel's silicon and package technologies under conditions that simulate real-world use, including thermal cycling, temperature extremes, and humidity exposure. We take pride in delivering trusted test environments and high-quality data that enable critical process development, qualification, and certification decisions for both internal and external stakeholders. This is an opportunity to contribute directly to cutting-edge technolo...
**Job Description:**
The Stress Testing and Reliability Laboratory is seeking a motivated, hands-on engineer to join our Environmental Stress Tool Engineering team. In this role, you will play a key part in advancing Intel's next-generation packaging technologies, including EMIB, Foveros, Hybrid Bonding, and Co-Packaged Optics, while supporting package qualification and technology development efforts.
Our team develops, operates, and maintains a diverse fleet of environmental stress systems used to evaluate the reliability of Intel's silicon and package technologies under conditions that simulate real-world use, including thermal cycling, temperature extremes, and humidity exposure. We take pride in delivering trusted test environments and high-quality data that enable critical process development, qualification, and certification decisions for both internal and external stakeholders. This is an opportunity to contribute directly to cutting-edge technolo...